English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The reaction diffusion between indium solder and Au deposited (Ni and Cu) substrates was investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy (SEM) and X-Ray Diffractometry (XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10, were observed for different substrates, respectively. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound followsthe parabolic law, which indicatesthat layer growth of the intermetallic compound wasmainly controlled by volume diffusion over the temperature range. The apparent activation energies for intermetallic compound growth were 37.06 kJ/mol for Cu11In9 and 86.14 kJ/mol for In27Ni10, respectively.

materials transactions

Reaction Diffusion and Formation of Cu&lt;SUB&gt;11&lt;/SUB&gt;In&lt;SUB&gt;9&lt;/SUB&gt; and In&lt;SUB&gt;27&lt;/SUB&gt;Ni&lt;SUB&gt;10&lt;/SUB&gt; Phases in the Couple of Indium-Substrates