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Microstructural evolution taking place in pure copper during multi-directional forging (MDF) at 77 K and 300 K was studied. Samples were deformed up to total strain of 6.0 at maximum. At 300 K, the flow curve showed a rapid increase in flow stress at the early stage of deformation followed by steady-state flow at strains above 2. The microstructural change during deformation at 300 K was mainly characterized by the evolution of subgrains, the increase in the misorientation angles, and subsequently followed by evolution of ultra fine grains of the average size of 300 nm. In contrast, at 77 K, the flow curve showed a monotonic increase in the flow stress all strains. Deformation twins, which started to appear at high strains resulted formation of dense lamellar microstructures. The thickness of deformation twins was ranging from 10 to 100 nm. The obviously appeared twins contributed to grain refinement at 77 K. Microstructures evolved during MDF at both temperatures showed different annealing behavior. That is, static recrystallization onset earlier and spread more rapidly in the copper MDFed at 77 K than that at 300 K.

Microstructural Evolution in Copper during Multi-Directional Forging at 77 K and Its Recrystallization Behavior