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Electronic chips are arranged in various manners according to design   conditions and constraints, and thus the influence of chip arrangement on   the entire thermal performance should be understood ahead of design and   manufacture of electronic cooling systems. In this paper, a minichannel heat   sink is considered for electronic cooling, and three kinds of chip   arrangement are designed and studied: diagonal arrangement [Case 1],   parallel arrangement [Case 2], and stacked arrangement [Case 3]. The   single-phase laminar liquid flow and conjugated heat transfer through the   minichannel heat sinks are investigated through Computational Fluid Dynamics   (CFD) technique for dealing with the normal-scale Navier-Stokes equations   and energy equations. Numerically predicted results are qualified by   comparing the previous experimental data and by a grid-independent test.   Temperature distributions on the chip surfaces are presented and the thermal   performance in terms of total thermal resistance is also compared. It is   found with diagonal arrangement [Case 1] the minichannel heat sink provides   the best thermal performance

Thermal analysis of the influent of chip arrangement of a water-cooled minichannel heat sink