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Efforts have been on going for several years to develop a 3D integrated pixel circuit with a bonded sensor. The development process has experienced numerous fabrication problems. The two wafer bonding processes used for 3D assembly were copper-copper thermocompression and oxide-oxide bonding. This paper will cover the main problems that were encountered along with techniques used to study the problems. It will also examine the sensor to 3D bonding technology that was used. Finally the first performance results of a successfully bonded 3D IC to sensor using these techniques will be presented. 22nd International Workshop on Vertex Detectors (Vertex 2013) September 15-20, 2013 Lake Starnberg, Germany

Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding