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The second part of the work* reports on the latest advancements in packaging of high power diode laser arrays. In this paper, the key factors, such as thermal management, processes development, failure analysis and reliability evaluation are presented in developing kW-level diode laser arrays. A variety of high power diode laser arrays are fabricated and tested. The results indicate that the devices with high power, narrow spectrum, high electro-optical efficiency and high reliability, are suitable for solid state laser pumping.

Advancements in Packaging of Kilo-Watts Level High Power Diode Lasers for DPSSLs Applications