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A new solvent system is being evaluated for use in the Modular Caustic-Side Solvent Extraction Unit (MCU) and in the Salt Waste Processing Facility (SWPF). The new system includes the option to replace the current dilute nitric acid strip solution with boric acid. To support this effort, the impact of using 0.01M, 0.1M, 0.25M and 0.5M boric acid in place of 0.001M nitric acid was evaluated for impacts on the DWPF facility. The evaluation only covered the impacts of boric acid in the strip effluent and does not address the other changes in solvents (i.e., the new extractant, called MaxCalix, or the new suppressor, guanidine). Boric acid additions may lead to increased hydrogen generation during the SRAT and SME cycles as well as change the rheological properties of the feed. The boron in the strip effluent will impact glass composition and could require each SME batch to be trimmed with boric acid to account for any changes in the boron from strip effluent additions. Addition of boron with the strip effluent will require changes in the frit composition and could lead to changes in melt behavior. The severity of the impacts from the boric acid additions is dependent on themore » amount of boric acid added by the strip effluent. The use of 0.1M or higher concentrations of boric acid in the strip effluent was found to significantly impact DWPF operations while the impact of 0.01M boric acid is expected to be relatively minor. Experimental testing is required to resolve the issues identified during the preliminary evaluation. The issues to be addressed by the testing are: (1) Impact on SRAT acid addition and hydrogen generation; (2) Impact on melter feed rheology; (3) Impact on glass composition control; (4) Impact on frit production; and (5) Impact on melter offgas. A new solvent system is being evaluated for use in the Modular Caustic-Side Solvent Extraction Unit (MCU) and in the Salt Waste Processing Facility (SWPF). The new system includes the option to replace the current dilute nitric acid strip solution with boric acid. To support this effort, the impact of using 0.01M, 0.1M, 0.25M and 0.5M boric acid in place of 0.001M nitric acid was evaluated for impacts on the DWPF facility. The evaluation only covered the impacts of boric acid in the strip effluent and does not address the other changes in solvents (i.e., the new extractant, called MaxCalix, or the new suppressor, guanidine). Experimental testing with the improved solvent is required to determine the impact of any changes in the entrained solvent on DWPF processing.« less

PRELIMINARY EVALUATION OF DWPF IMPACTS OF BORIC ACID USE IN CESIUM STRIP FOR SWPF AND MCU