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The support structures for the new Layer 0 (Figures 1, 2, 3) of the Run 2b silicon tracker in D0 were designed and fabricated at the University of Washington. These structures were required to have minimum mass, yet be very rigid so as to meet the high precision requirements placed on the position of the silicon detector chips. They also have to provide for cooling to remove the heat generated by the sensors and signal processing electronics and to keep the sensors at the desired operating temperature (below -5 C). All of these requirements were best met by carbon fiber/epoxy composite technology. State of the art carbon fiber materials have extremely high Young's moduli and high thermal conductivity. Appropriate fiber lay-ups and fabrication methods have been developed and used successfully to produce both various prototype structures and the structures used in the production Layer 0. The geometry of these structures was determined mainly by the geometry of the sensors themselves. The structures incorporated a complete cooling system consisting of extruded PEEK coolant tubes and distribution manifolds made from carbon fiber composites. In order to determine the mechanical and thermal performance of the structures, detailed FEA analyses of L0 have been carried out and are described

Design and Analysis for the Carbon Fiber Composite Support Structure for Layer 0 of the D0 Silicon Micro Tracker