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This paper summarizes polariscopy work that led to prototype non-contact, near-infrared light-transmission system for inspecting thin, flat, large-area Si wafers. Acoustic work led to commercially viable system to inspect wafers for microcracks

Full Field Birefringence Measurement of Grown-In Stresses in Thin Silicon Sheet: Final Technical Report, 2 January 2002 - 15 January 2008