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A series of tests was run to determine the effect of Ni plating thickness on connector contact resistance. Copper coupons were plated with an electrolytic nickel strike followed by electroless nickel to produce Ni layers of 10, 20, 55 and 100 {micro}in. The coupons were then exposed to a simulated industrial environment. Pore corrosion was observed after the exposure, which correlated with Ni thickness. In a second series of tests, beryllium-copper four-tine contacts with 50 {micro}in of gold plate over electrolytic nickel strike/electroless-nickel plates of varying thickness were exposed the same corrosive environment. Contact resistance of mated pairs was monitored over a two-month period. The degradation in contact resistance correlated with the Ni thickness used in the connectors

Effectiveness of nickel plating in inhibiting atmospheric corrosion of copper alloy contacts