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A reliable process for the fabrication of multilayer printed wiring boards has been further improved by implementing a solder-dip-and-level process in place of the conventional pattern-tin-lead-plate process. A commercial chronic acid etchant has proven to be superior to the previously used sulfuric acid etchback solution. An economical, disposable polyvinyl-fluoride-film release sheet has been adopted, and a nuclear static-electricity eliminator has proven effective in providing lint-free panels.

Improved methods of fabricating multilayer printed wiring boards. Final report