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Selective electrodeposition onto specially masked surfaces (producing blind holes with non-conductive side walls) has been investigated. The thick masks are low cost polymer sheet into which holes and other patterns are machined. Plating with this type of masking system is one method of fabricating medium aspect ratio metallic structures (structures whose width to length ratio is greater than 10/1). The experiment was conducted with deposits of OFC copper from an acid sulfate solution, but similar results are expected with other metals. Structure diameter varied from 0.25 mm to 3.8 mm (0.01`` to 0.150``). The effect of current density, electrolyte concentration, solution temperature, and agitation on deposition rate were investigated. Deposit quality, deposition rate, and optimal plating parameters were evaluated

Optimizing fabrication of electrodeposited 3D surface features