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The objective of this project was to formulate the pulverized electronic waste (PEW) stream derived from grinding obsolete electronic assemblies and combine this material with thermoplastic or thermosetting polymers into useful, high-value commercial products materials. PEW consists primarily of various thermoset plastic materials and glass fibers from the printed wiring boards, along with ceramic pieces from chip carriers and other electronic components. Typically, the thermosetting materials have the same desirable properties as in the original electronic assembly, including relatively high temperature resistance, excellent chemical resistance, and flame retardancy. These properties combine to make PEW an inherently good inert filler material for plastic composites

Formulation of Molding Materials From Recycled Printed Wiring Boards