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Adhesive bonding has become increasingly important for industrial appliances. One reason for this is the increasing demand to join different materials in lightweight constructions of materially optimized designs. However, bonding processes need a high degree of supervision. Therefore, non-destructive testing methods of short duration need to be applied. This brings the methods shearography and active thermography into focus. This paper aims to compare eddy current shearography and thermography for the non-destructive testing of structural bonds. Different defects are examined in a transmission arrangement. The study shows the results for defect detection in ideal as well as application-oriented testing samples.

Comparison of inductive shearography and thermography for flaw detection in structural adhesives on ideal and application-oriented specimen