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Thermal characterization of individual diode lasers and laser bars by means of infrared thermography is performed. Different heat sink solutions suitable for high power devices are analyzed. Temperature profiling results for individual diode lasers mounted on copper blocks and in modified TO-3 packages are presented. For laser bars active cooling with different constructions of micro-channel heat sinks is employed. NOVEC 7000 series fluids and alternatively deionized water is used as a cooling medium. Methodological approach to thermographic characterization of high-power diode lasers and laser bars is presented.

Temperature profiling of diode lasers and laser bars by means of infrared thermography