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Heat dissipation is one of the major problems in modern electronic components. Therefore it is essential to provide proper cooling of such devices, often using forced convection due to its effectiveness. This paper describes the thermal wave method in new application to evaluate convection cooling conditions of electronic devices. In the mentioned method authors investigated the thermal response of the aluminum oxide board with heating resistor. Obtained thermal response was undergone Fourier and wavelet transforms. Given frequency spectrum was analyzed and the authors focused on the phase of thermal response. In addition Fourier and wavelet transforms comparison was performed. Results of the research were presented below.

Evaluation of convection cooling conditions using Fourier and wavelet analysis in lock-in thermography