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In the present work, the curing process of a thick thermosetting polymer matrix was investigated through experimental and Finite Element analyses. The study was carried out on COMSOL Multiphysics® software considering coupled thermal and chemistry phenomena involved in an epoxy’s polymerization process. The curing parameters of two single-step and one two-step curing were investigated, denoting defective samples from the two first cases due to thermal degradation and a defect-free sample from the last one. Numerical results were in good agreement with experimental records, and thus reveal the potential of this COMSOL® FE simulation.

Numerical and experimental analyses on the curing of a thick thermosetting polymer matrix