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porous Si3N4 ceramic and their thermal conductivity was evaluated. A porous Si3N4 ceramic having a porosity of 39.5% and consisting of elongated ƒÀ-Si3N4 grains connected at random in three dimensions was used as a substrate. The Al-Si3N4 composites were fabricated by infiltration of Al-Si alloys melt into the porous Si3N4 ceramic at 800•Ž under a pressure of 90MPa using hot isostatic pressing (HIP). Although increasing Si con tent significantly decreased the thermal conductivity of the Al-Si alloys, the decrease in thermal conductivi ty of the resulting composites was small due to increased thermal barrier conductances of the interfaces be tween Al and Si3N4. [Received January 11, 2001; Accepted February 16, 2001]

Fabrication of Al-Si3N4 Composites Using a High-Strength Porous Si3N4 Ceramic and Their Thermal Conductivity.