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Microstructure of TiN/Si3N4 ceramics was tailored by using a cosintering process of their agglomerates, then structure-properties relations were examined by measuring mechanical property and electrical conductivity of TiN/Si3N4. The TiN/Si3N4 material using TiN and Si3N4 agglomerates showed duplex microstructure. This materials showed a sudden onset of electrical conduction at a lower TiN content than that of conventional composites. The duplex materials exhibited a higher fracture toughness than that of the normal composites, while other hand its strength remained at the same level of TiN. It is concluded that higher fracture toughness of duplex materials resulted from the complex fracture path at the interface between Si3N4 and TiN agglomerates.

nihon seramikkusu kyoukai gakujyutsu rombunshi/nippon seramikkusu kyōkai gakujutsu rombunshi

Optimization of Mechanical and Electrical Properties of TiN/Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt; Material by Agglomerates-Microstructure-Control