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Electrophoretic deposition (EDP) is gaining increasing attention both in science and industry, due to novel applications in the processing of advanced ceramic materials and ceramic coatings. Electrophoretic deposition has become very interesting because this method has allowed the formation of thin films or multilayer films of controlled thickness and morphology, enabling the formation of films on substrates of complex geometry, aimed for different applications. This review paper represents the mechanism of electrodeposition of ceramic coatings (alumina and boehmite coatings) on metal surfaces, as well as the determination of the optimal deposition parameters (applied voltage, deposition time, electrodeposition bath temperature, suspension concentration) in order to control the thickness and morphology of deposited films. It was shown that coatings of maximum thickness, low porosity and good adhesion were obtained at lower deposition voltages and for longer deposition times.

Electrophoretic deposition of alumina and boehmite coatings on metal surfaces