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vi LIST OF TABLES  xi LIST OF FIGURES  xiii CHAPTER ONE: INTRODUCTION 1 1.1: Motivation for Research 1 1.2: Research Objectives 2 1.3: Materials and Bonding Type 3 1.4: Joining Processes 8 1.5: Literature Review 18 CHAPTER TWO: MATERIALS 26 2.1: Inconel 600 26 2.2: Silicon Carbide (SiC) 29 2.3: Interlayer Materials 32 CHAPTER THREE: EXPERIMENTAL PROCEDURE 35 3.1: Sample Preparation before bonding 36 3.2: Joining Procedure 38 3.3: Sample Characterization 43 3.3.1: Microstructural Characterization 43 3.3.2: X-Ray Diffractometry 44

Diffusion Bonding of Inconel 600 to Silicon Carbide for Next Generation High Temperature Applications