English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Engineers, those who are tasked to design modern electronic devices face many issues related to smaller packages with more components. This leads to more power dissipation. Hence cooling of devices becomes a necessity. Heat sinks are inevitably are used for thermal management of the Electronic devices. This paper compares temperature variations from inlet to outlet for different types of heat sinks placed in air and fluid domain and ways to increase efficiency of heat sinks using phase change materials are investigated through simulations using Ansys fluent simulation tool.

Effect of using PCM as Cooling Medium in Different Types of Heat Sinks