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A novel bottom-up electrochemical plating technology is proposed and demonstrated. This reproducible plating technology possesses several advantages for fabricating regular copper arrays. The process eliminates surface voids and defects. Copper lines with 40 nm in width and copper pillar with 60 nm in diameter are formed by electrochemical copper plating combined with e-beam patterning. High quality crystalline copper lines and pillars were produced by making use of low electrolyte concentrations. Further, the height of structures was precisely monitored in situ by calculating the amount of charge needed for electroplating. This bottom-up plating approach meant that the over-fill problem commonly associated with electroplating could be avoided. The result was regular copper nanostructures. This technology could be applied in the manufacture of various nano-scale structures using different metals.

Controllable Height of Regular Copper Array Using Electrochemical Plating