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Malgorzata Musztyfaga-Staszuk1, Damian Janicki1, Piotr Panek2, Maciej Wiœniowski3 1Silesian University of Technology, Welding Department, 18a Konarskiego Street, 44-100 Gliwice, Poland 2Insitute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakowska 22, 43-340 Kozy, Poland 3Silesian University of Technology, Institute of Engineering Materials and Biomaterials, Konarskiego street 18a, 44-100 Gliwice, Poland malgorzata.musztyfaga@polsl.pl

Use of a laser disc for cutting silicon wafers