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OPP and OPET metallized films are widely used as substrates in multi layer packages, since they bring together good mechanical properties and barrier to gases and water vapor, which are damaged with delamination of the film layers, together with the visual appearance and package integrity. One of the main factors that affect the package delamination is the adhesion strength of aluminum layer to the polymeric substrate, a parameter for which there is no standard procedure to quantify. The aim of this work was to establish and validate a procedure to determine the adhesion strength of the aluminum to the polymer. This test procedure was carried out using experimental design with fixed and variables parameters with two levels for each variable. The test procedure was stable, robust and replicable. It consisted basically of the heat sealing of a plastic film to the metallized sample surface, under specific temperature/time/pressure conditions and the measuring of adhesion strength of metallization in a universal test machine running at specific angle and speed

Determinação da força de adesão da metalização com alumínio em filmes plásticos utilizados em embalagens flexíveis