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A multilayer diplexer in a low temperature co-fired ceramic substrate for compact ultra-wideband (UWB) wireless modules is presented. This diplexer can separate the band group 1 (3.168-4.752GHz) of multiband orthogonal frequency-division multiplexing UWB systems from the band groups 3 and 4 (6.336-9.504GHz) of the same systems. The basic characteristics of the diplexer are simulated with a circuit simulator and an electromagnetic simulator. The fabrication and measurement of the presented diplexer are also carried out. The measured results of the fabricated diplexer agree well with the simulated results. The insertion losses are less than 2.0dB and the isolation characteristics are higher than 30dB. The diplexer achieves a compact size (7.2 x 3.6 x 0.384mm3).

A study on a multilayer diplexer using LTCC technology for ultra-wideband wireless modules