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3D ICs is a solution for multi-core processors, with critical challenge of internal thermal problem. A new solution for this problem is interlayer cooling system, which expands the floorplan design space of micro-processors in 3D ICs. This work proposes a floorplanner for multicore processor in 3D ICs with interlayer cooling system, integrated with greedy and particle swarm optimization method. The results show that the maximal temperature and temperature gradient reduced by 10.3°C and 9.2°C respectively, compared with the baseline design in 3 active device layers.

Floorplanner for multi-core micro-processors in 3D ICs with interlayer cooling system