Book Reviews - Microelectronics Packaging Handbook Edited by Rao R. Tummala and Eugene J. Rymaszewski; (Van Nostrand Reinhold, New York, 1989 approx. 1160 pages. ISBN: 0-442-20578-3 - Nonlinear Phenomena in Materials Science Edited by L.P. Kubin and G. Martin (Trans Tech Publications, Switzerlan1988), approx. 500 pages. ISBN: 0-87849-565-7 - Superalloys, Supercomposites and Superceramics Edited by John K. Tien and Thomas Caulfield (Academie Press, 1989), 755 pages.ISBN: 0-12-690845-1 | Zendy

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Book Reviews - Microelectronics Packaging Handbook Edited by Rao R. Tummala and Eugene J. Rymaszewski; (Van Nostrand Reinhold, New York, 1989 approx. 1160 pages. ISBN: 0-442-20578-3 - Nonlinear Phenomena in Materials Science Edited by L.P. Kubin and G. Martin (Trans Tech Publications, Switzerlan1988), approx. 500 pages. ISBN: 0-87849-565-7 - Superalloys, Supercomposites and Superceramics Edited by John K. Tien and Thomas Caulfield (Academie Press, 1989), 755 pages.ISBN: 0-12-690845-1

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