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The grain boundary network of nanocrystalline Cu foils was modified by thesystematic application of cyclic loadings and elevated temperatures having arange of magnitudes. Most broadly, the changes to the boundary network weredirectly correlated to the applied temperature and accumulated strain,including a 300% increase in the twin length fraction. By independently varyingeach treatment variable, a matrix of grain boundary statistics was built tocheck the plausibility of hypothesized mechanisms against their expectedtemperature and stress/strain dependences. These comparisons allow the field ofcandidate mechanisms to be significantly narrowed. Most importantly, the effectof temperature and strain on twin length fraction were found to be stronglysynergistic, with the combined effect being ~150% that of the summed individualcontributions. Looking beyond scalar metrics, an analysis of the grain boundarynetwork showed that twin related domain formation favored larger sizes andrepeated twin variant selection over the creation of many small domains withdiverse variants. Taken together, the evidence indicates that shear-coupledboundary migration twinning is the most likely explanation for grain boundaryengineering in nanocrystalline Cu.

Pronounced grain boundary network evolution in nanocrystalline Cu subjected to large cyclic strains