English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Electronic equipment is becoming smaller in size, lighter in weight and higher in performance. The printed wiring boards for the equipment are designed to small, fine and high density mountings, which result in small distance and high electric field strength between the foil conductors on the board. The insulating failures may occur on the board under such conditions. From this view point, the surge endurance between foil conductors across a narrow gap on a printed wiring board with or without backing electrode was measured in air at a room temperature by four institutions using the same test boards. The measurements were carried out in air at a room temperature and 40-55%RH. Figure 1 shows the configurations of the test sample. Two different shapes of the foil conductors, A_type and B_type, were tested. The gap distances studied ranged from 20μm to 200μm, and the thickness of the foil conductor on the board was 6μm or 18μm. The board thicknesses were from 60μm to 800μm. FOV (flashover voltage) was measured under the impulse voltage application (1.2/50μs). Figures 2 and 3 show FOV characteristics with A_type. FOVs are almost independent of the foil thickness of the boards both with and without backing electrode. For the board with backing electrode, positive FOV is higher than negaitve one. When the board thickness is 60μm, the increase in FOV with the gap length is saturated. As shown in Fig.3, FOVs are almost uninfluenced by the board thickness in the gap distance area <50μm. These characteristics mentioned above are observed also in the test board of B_type.

Surge Endurance between Foil Conductors across a Narrow Gap on Printed Wiring Board