English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The wide application of commercial grades of copper, containing different impurities, in many fields of industry requires profound analysis of their influence on weldability. At the present work the integrated evaluation of effect of main impurities on copper susceptibility to formation of cracks and pores was made using electron-fractographic and X-ray analysis and also new methods, developed by the authors, for evaluation of tendency of copper to formation of solidification cracks. It is shown that simultaneous presence of different impurities in copper unlike the binary system of copper—impurity reduces its tendency to solidification crack formation. Content of 0.2 % Ni increases the crack resistance of copper. It was established that level of influence of low-melting impurities on crack formation in weld metal and near-weld zone depends on their distribution coefficient. It was for the first time established that low-melting surface-active impurities with a low distribution coefficient (K < 0.05) increase the tendency of welds to pore formation. The obtained results of investigations allow developing new consumables for welding of copper and its alloys. 15 Ref.. 2 Tables, 3 Figures.

Integrated evaluation of effect of main impurities on weldability of copper