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We present a setup and procedure of studying p-n j unction-package thermal resistance in high-power light-emitting diodes (LED s) from their thermal relaxation. A set of LEDs mounted on a metal-core printed circuit board (MCPCB) were studied. The contributions to the total thermal resistance from a heavy heat sink, MCPCB, heat slug and LED chip are separated.

Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs