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Objectives: The purpose of this study was to evaluate the ozone exposure levels and the variations in ozone concentration in a semiconductor fabrication facility and office in relation to the ozone concentration in the outdoor air. Methods: This study was performed in an office, semiconductor fabrication facility(such as etching, diffusion, diffusion plenum), and outdoors from June to August, 2015. Measurements were taken six times at the same places using an active sampler(pumped) and real-time equipment. Ozone monitoring by the active sampler method and analysis were carried out by OSHA Method ID-214. Real-time measurement was carried out by ozone measuring equipment using a non-dispersive ultraviolet absorption method. Results: Ozone concentrations in the semiconductor fabrication facility and office were 0.7~7.1 ppb in area samples and 0.72~4.07 ppb in real-time measurement, which were 0.88~8.88% of the occupational exposure limit. The concentration of ozone generated by a laser printer in the office was less than 2 ppb. There was not a significant difference between ozone concentrations before and after using the laser printer. The indoor/outdoor concentration ratio(I/O ratio) in the semiconductor fabrication facility and office was 0.05 and 0.06, respectively. Conclusions: All the samples contained ozone levels lower than the occupational exposure limit and it was confirmed that the concentration of outdoor ozone had no significant effect on indoor ozone concentration.

A Study of Ozone Variations in a Semiconductor Fabrication Facility and Office Related to the Ozone Concentration in the Outdoor Air