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Panels using solar power require high reliability, and the residual stress in the solar panel has an important effect on its reliability and lifetime. The finite element method was adopted to simulate the impacts of the rectangular solar panel encapsulation process parameters, such as the elastic modulus, the thickness of adhesive, and the curing temperature on the residual stress in the solar cell module. The results show that the residual stress in the solar cell module increases linearly with the increase in these three factors. The residual strain is consistent with that of the stress. The generation mechanism and distribution evolution of stress are discussed in detail. Both the thickness and the elastic modulus of the silicone rubber have significant impact on the residual stress. However, the influence of the curing temperature is less observable.

Effects of the Curing Process on the Residual Stress in Solar Cell Module