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Metals with a bimodal grain size distribution have been found to have both high strength and good ductility. However, the coordinated deformation mechanisms underneath the ultrafine-grains (UFGs) and coarse grains (CGs) still remain undiscovered yet. In present work, a bimodal Cu with 80% volume fraction of recrystallized micro-grains was prepared by the annealing of equal-channel angular pressing (ECAP) processed ultrafine grained Cu at 473 K for 40 min. The bimodal Cu has an optimal strength-ductility combination (yield strength of 220 MPa and ductility of 34%), a larger shear fracture angle of 83° and a larger area reduction of 78% compared with the as-ECAPed UFG Cu (yield strength of 410 MPa, ductility of 16%, shear fracture angle of 70°, area reduction of 69%). Grain refinement of recrystallized micro-grains and detwinning of annealing growth twins were observed in the fractured bimodal Cu tensile specimen. The underlying deformation mechanisms for grain refinement and detwinning were analyzed and discussed.

Revealing grain coarsening and detwinning in bimodal Cu under tension