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In the copper ball bond process, aluminum squeezes out under the ball deformation process since it is softer than copper. The final thickness of the copper ball decides the overall strength of the bond and hence knowledge of its final thickness helps to optimize the ball bond force during the bonding process. An etching method is developed for the analysis of the squeezed aluminum beneath the copper wire ball bond. The aluminum remnant obtained from the etching method is compared with that from the conventional cross-section method. It was found that the results are comparable and the present developed etched method is simple and elegant.

Measurement of Deformed Aluminum Layer of Bond Pads in Cu-Wire Bonded Integrated Circuit Devices Using a Etching Approach