English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

With the addition CNTs, the properties of SnAgCu solders and solder joints can be improved remarkably. In this paper, based on the creep testing, the Dorn creep model was used to represent the creep behavior of SnAgCuCNT solder, and the parameters were determined with the fitting analysis. Moreover, the Dorn creep model of SnAgCu and SnAgCuCNT was incorporated into finite element code for calculating the creep strain response of solder joints in FCBGA (Flip Chip Ball Grid Array) device during thermal cycle loading. The results indicated that the CNTs can enhance the creep resistance of SnAgCu solder, which demonstrates the SnAgCuCNT solders can replace the SnAgCu solder in electronic industry for highreliability requirement.

Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device