English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The adaptation of titanium/titanium nitride barriers which are commonly used for tungsten-filled contacts to aluminum-filled contacts has encountered some limitations. A main issue is the decomposition of titanium nitride manufactured by physical vapour deposition through reaction with aluminum. In this investigation two different concepts for barrier improvement have been pursued: 1. stuffing of a conventional barrier by a rapid thermal process in an oxygen-rich atmosphere and, 2. use of a barrier manufactured by chemical vapour deposition. The aim of the transmission electron microscopic analysis was to explain different electrical breakdown characteristics during thermal stressing of chips with these barriers. Energy-filtered transmission electron microscopy was used to monitor elemental distributions down to nanometer scale. Both concepts are found to improve barriers for aluminumfilled contacts.

international journal of materials research

An investigation of improved titanium/titanium nitride barriers for submicron aluminum-filled contacts by energy-filtered transmission electron microscopy