English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Pro

Presents the zaia usage as premium feature

ZAIA

Presents AI Discovery search usage as a premium feature

AI Discovery

Presents AI Discovery explain and summary usage as a premium feature

Content Analysis

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Presents the pdf analysis as premium feature

PDF Analysis

1500 Top-up

3000 Top-up

Zendy Basic

2500 Top-up

Zendy Unlimited

Presents the access of premium content as premium feature

Premium Content

Driven by the requirement of high cutting efficiency and improvement of wafer flatness, wire sawing of GaAs single crystals under brittle material removal conditions has been studied. Crack nucleation and crack propagation were investigated by indentation and scratching tests on polished {100}-oriented semi-insulating GaAs wafers. Based on these results a concept has been developed that allows to control the force balance in the cutting slits so that the deflection of the wires perpendicular to the cutting planes is minimal resulting in cuts of high flatness. The concept has been successfully introduced in mass production of GaAs wafers.

Material-related fundamentals of cutting techniques for GaAs wafer manufacturing