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This paper presents the first study of the plastic behavior of NiAl thin films with thicknesses in the micron and sub-micron range. The influence of geometrical and microstructural constraints was studied for different Al contents (45 to 50 at.% Al) and film thicknesses (0.2 to 3.1 μm) in the temperature range from 20 to 700 °C. The films were deposited on Si substrates and subjected to temperature changes resulting in thermal strains of up to 0.84%. The stress evolution in the films was measured by the substrate curvature method. The residual stress at room temperature of nearstoichiometric NiAl films significantly increased with decreasing film thickness indicating an increase of the film strength. At temperatures above 400 °C strong stress relaxation was found, which was more pronounced in thinner films suggesting the contribution of diffusional creep processes. The existence of a critical film thickness is suggested at which a transition from diffusion-controlled to dislocation-controlled plasticity occurs. The results have potential implications for the reliability of NiAl films as protective coatings in thermal engines.

Size effects in the plastic deformation of NiAl thin films