English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The growth kinetics of intermetallic compound layers formed between Sn–3Ag–8Bi – 5In solder and (Cu, electroless Ni – P/Cu) substrate were investigated at temperatures between 70 and 170 °C for 1 to 60 days. The layer growth of the intermetallic compounds in the Sn–Ag– Bi – In/Cu and Sn–Ag –Bi – In/electroless Ni –P systems satisfied the parabolic time law. As a whole, because the values of time exponent have approximately 0.5, the layer growth is mainly controlled by diffusion. The apparent activation energies for the growth of the Cu 6 Sn 5  and Ni 3 Sn 4  intermetallic compounds are 81.4 and 67.1 kJ/mol, respectively.

Investigation of interfacial reactions between Sn–Ag–Bi–In solder and (Cu, electroless Ni–P/Cu) substrate