Physical Aspects of Wood Adhesive Bond Formation with Formaldehyde Based Adhesives. Part III. The Creep Behavior of Formaldehyde Based Resins at Different Relative Humidities | Zendy

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Physical Aspects of Wood Adhesive Bond Formation with Formaldehyde Based Adhesives. Part III. The Creep Behavior of Formaldehyde Based Resins at Different Relative Humidities

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