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A kind of three dimensional Low Temperature Co-fired Ceramic (LTCC)-System in Package (SIP) transition was proposed in this paper. The basic design of SIP with LTCC technology was done by vertical transitions which transmit the microwave signal from the bottom to the surface of the substrate. The measured insertion loss did not exceed 1.5 dB, which contains the insertion loss of the test board about 0.6 dB at 18 GHz and the return loss was better than -15  dB up to 18 GHz. Then this technology was applied to a kind of phase shifting and amplifier module with two output ports. Basing on this module, a miniature Ku-band active phase array antenna was realized. The design results in a small size (84.8 mm×84.8 mm×55 mm) . The measured performance of systems radiation pattern was also given.

High Integrated Microwave Architecture Using LTCC-SIP Technology in Active Phased Array Antenna Applications