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Epoxy encapsulant with high glass transition temperature ( T g  ) is required to ensure light emitting diode (LED) functions properly during its service life. Epoxy blends (cycloaliphatic epoxy, diglycidyl ethers of bisphenol-A and novolac resin) were thermally cured using methylhexahydrophthalic anhydride. Effects of the three types epoxy resins on the  Tg  of the ternary blends were examined. The  T g   was mainly controlled by the concentration of cycloaliphatic epoxy. Optimization with constraint was conducted to produce epoxy blends formulation with optimum  T g  . It was found that linear mixture model can fit well the experimental  T g  of the epoxy ternary blends.

Thermal behavior of epoxy blends for light emitting diode encapsulation