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Mask aligners are lithographic tools used to transfer a pattern of microstructures by shadow printing lithography onto a planar wafer. Contact lithography allows us to print large mask fields with sub-micron resolution, but requires frequent mask cleaning. Thus, contact lithography is used for small series of wafer production. Proximity lithography, where the mask is located at a distance of typically 30–100 μm above the wafer, provides a resolution of approximately 3–5 μm, limited by diffraction effects. Proximity lithography in mask aligners is a very cost-efficient method widely used in semiconductor, packaging and MEMS manufacturing industry for high-volume production. Micro-optics plays a key role in improving the performance of shadow printing lithography in mask aligners. Refractive or diffractive micro-optics allows us to efficiently collect the light from the light source and to precisely shape the illumination light (customized illumination). Optical proximity correction and phase shift mask technology allow us to influence the diffraction effects in the aerial image and to enhance resolution and critical dimension. The paper describes the status and future trends of shadow printing lithography in mask aligners and the decisive role of micro-optics as key enabling technology.

Micro-optics and lithography simulation are key enabling technologies for shadow printing lithography in mask aligners