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Titanium-based functional thin films were prepared by a sputtering deposition method using a metal powder target. To determine the deposition mechanism of the resulting TiO2 thin films, the electron density and temperature of the processing plasma were investigated. The deposition rate using powder targets was 3-5 times higher than that using bulk targets. The reasons for the increased deposition rate were considered as follows. The net surface area of a powder target is twice that of a bulk target. The gamma value for ions at slanting incidence to the target surface is higher than that for perpendicular incidence. The surface temperature of the powder target was higher than that of the bulk target. The hollow cathode effect may be implicated in the case of powder targets.

Kinetics of TiO<sub>2</sub> thin film fabrication by sputtering deposition using metal based powder target