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Objective: This study aimed to evaluate the effect of diode laser irradiation (970 nm) of a one-step self-etch adhesive (Clearfil S 3 Bond/CS3B) and of the bonding agent of a two-step self-etch adhesive (Clearfil Liner Bond F/CLBF) placed on dentin before polymerization on the shear bond strength. Material and methods:  Forty sound premolars were sectioned buccally to obtain flat dentin surfaces. The specimens were divided into 4 groups (n=10): Group (OS) – CS3B + polymerization. Group (OS-L) – CS3B + laser + polymerization. Group (TS) – CLBF (bonding agent only) + polymerization. Group (TS-L) – CLBF (bonding agent only) + laser + polymerization. The diode laser was irradiated through an 8 mm bleaching tip for 10 seconds, (0.4 W, 10 Hz, 4 J). All samples were cemented to composite blocks submitted to 4000 thermal cycles. The samples were tested for shear bond strength in a universal testing machine. Data obtained was analyzed using Two-way (ANOVA) (P ≤ 0.05) and the Bonferroni post-hoc test. Representative samples from each group were analyzed using scanning electron microscopy (SEM). Results:  Group TS-L – ( 7.43 MPa) displayed statistically significant higher shear bond strength in comparison to that of group TS – (5.13 MPa). No statistically significant difference was found between group OS-L – (6.49 MPa) and group OS – (7.28 MPa). Group TS-L exhibited the highest resin penetration beyond the hybrid layer under SEM. Conclusions: Diode laser irradiation of a bonding agent placed on dentin without prior priming increased the bond strength to dentin and is promising as a new dentin adhesion protocol.

brazilian dental science

Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin