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The dominant photon detectors and focal plane arrays (FPAs) in the mid-wave infrared (MWIR) range (λ = 3 μm to 5 μm) use single crystal InSb and HgCdTe materials. The cost of these detectors is high, and cooling at approximately 80 K to 120 K is required to reduce the dark current. Colloidal quantum dots (CQDs) can be used to provide the speed and detectivity (D*) of the quantum detectors with lower fabrication costs than those of single crystal epitaxial materials. The aim of this study is to develop a MWIR area array sensor with an HgCdTe-ternary alloyed semiconductor CQD using a commercially available silicon readout integrated circuit (ROIC). First, we synthesized a solution processed HgCdTe CQD responsive in the MWIR range at room temperature and developed a Schottkey junction photodiode array of 10 × 10 pixels based on the same quantum dots (QDs) to produce a HgCdTe-Si interface suitable for a MWIR photodiode at room temperature. After ensuring its functionality, we developed a 320 × 256-pixel focal plane array (FPA) responsive in the MWIR region by hybridization of the HgCdTe CQD layer over a silicon ROIC die with a direct injection input circuit. The FPA was operated using an indigenously developed Field Programmable Gate Array (FPGA)-based drive unit, and different IR targets were imaged to evaluate its use as a low-cost MWIR FPA. NEΔT value of 4 K achieved at room temperature.

Uncooled Mid-wave Infrared Focal Plane Array Using Band Gap Engineered Mercury Cadmium Telluride Quantum Dot Coated Silicon ROIC