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A key component for optical on-chip communication is an efficient lightsource. However, to enable low energy per bit communication and localintegration with Si CMOS, devices need to be further scaled down. In this work,we fabricate micro- and nanolasers of different shapes in InP by direct waferbonding on Si. Metal-clad cavities have been proposed as means to scaledimensions beyond the diffraction limit of light by exploiting hybridphotonic-plasmonic modes. Here, we explore the size scalability ofwhispering-gallery mode light sources by cladding the sidewalls of the devicewith Au. The metal clad cavities demonstrate room temperature lasing uponoptical excitation for Au-clad devices with InP diameters down to 300 nm, whilethe purely photonic counterparts show lasing only down to 500 nm. Numericalthermal simulations support the experimental findings and confirm an improvedheat-sinking capability of the Au-clad devices, suggesting a reduction indevice temperature of 473 K for the metal-clad InP nanodisk laser, compared tothe one without Au. This would provide substantial performance benefits even inthe absence of a hybrid photonic-plasmonic mode. These results give us insightinto the benefits of metal-clad designs to downscale integrated lasers on Si.

Scaling of Metal-Clad InP Nanodisk Lasers: Optical Performance and Thermal Effects