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Photonic integration has witnessed tremendous progress over the last years,and chip-scale transceiver systems with Terabit/s data rates have come intoreach. However, as on-chip integration density increases, efficient off-chipinterfaces are becoming more and more crucial. A technological breakthrough isconsidered indispensable to cope with the challenges arising from large-scalephotonic integration, and this particularly applies to short-distance opticalinterconnects. In this letter we introduce the concept of photonic wirebonding, where transparent waveguide wire bonds are used to bridge the gapbetween nanophotonic circuits located on different chips. We demonstrate forthe first time the fabrication of three-dimensional freeform photonic wirebonds (PWB), and we confirm their viability in a multi-Terabit/s datatransmission experiment. First-generation prototypes allow for efficientbroadband coupling with overall losses of only 1.6 dB. Photonic wire bondingwill enable flexible optical multi-chip assemblies, thereby challenging thecurrent paradigm of highly-complex monolithic integration.

Photonic Wire Bonds for Terabit/s Chip-to-Chip Interconnects