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To achieve precise temperature control, Peltier devices, which are also called thermoelectric coolers, are widely used. However, simulating the unsteady temperature history caused by the Peltier devices is difficult because the amounts of heat absorption and generation are affected by their temperature. The temperature dependence reportedly can be calculated using the quadratic equation of temperature and the typical temperature characteristic coefficients. However, as the temperature dependence varied among the manufacturers, the temperature characteristic coefficients had to be modified for each of the devices. We developed a technique to determine the temperature characteristic coefficients of the Peltier device automatically by using data assimilation. We integrated the particle filter, one of the data assimilation algorithms, into the thermal network method and enabled estimating the suitable temperature characteristic coefficients. To demonstrate the estimation, we evaluated a Peltier device. The constant current 1.0 A and its inverse current were applied to the sample device repeatedly, and the temperature of the control object fluctuated repeatedly between 40 °C and 90 °C was measured. The temperature change was simulated using the thermal network method with the typical temperature characteristic coefficients and the history was compared with the measurement results. The root mean square error of temperature between the measurement and the calculation results was 3.20 K. Then, we estimated the applicable value of the temperature characteristic coefficients by applying the particle filter combined with the thermal network model. When the estimated coefficients were applied to the thermal network model, the root mean square error of temperature decreased to 1.39 K. Key words   ペルチェ素子には,機械的な可動部が無く小型化が容易である,印加する電流の制御により加熱冷却を容易に 制御できる,といった利点がある.その利点を活かし,レーザダイオードの冷却(Labudovic and Li, 2004)や,医用 分析装置における試薬,検体の温度制御(Pogfai et al., 2008)といった,局所的な温度制御や精密な温度制御を必要 とする機器に用いられている.このようなペルチェ素子を搭載する機器の熱設計を行う場合,吸熱量だけでなく, 発熱量を考慮し,放熱面の熱設計を正しく行うことが重要であり,ペルチェ素子の吸発熱量を正確に見積もる必 要がある.ここで,ペルチェ素子で広く用いられる半導体材料であるビスマステルル系合金(Bi2Te3)の熱物性は, 温度に依存することが報告されており,ペルチェ素子の吸発熱量は,印加する電流,電圧だけでなく,素子自身 *1 正員,(株) 日立製作所 研究開発グループ(〒312-0034 茨城県ひたちなか市堀口 832-2) *2 正員,(株) 日立ハイテクノロジーズ(〒312-8504 茨城県ひたちなか市市毛 882) E-mail of corresponding author: wataru.sato.af@hitachi.com Received 9 May 2016 No.16-00207 [DOI:10.1299/transjsme.16-00207], J-STAGE Advance Publication date: 8 December, 2016 1 熱回路モデルとデータ同化を利用したペルチェ素子の温度特性係数推定手法

Thermal network model-based data assimilation for estimation of temperature characteristic coefficients for Peltier device